ECCOSTOCK^® FPH is a rigid, low The power loss in a dielectric due to heating as a wave passes through it. It can be expressed as "dielectric loss tangent" (power factor) or "loss factor". Low loss makes a good dielectric (ECCOSTOCK dielectric materials). High loss is an absorber (ECCOSORB), poor dielectric.dielectric loss, high temperature polyurethane (Toluene diisocyanate (TDI) is an aromatic hydrocarbon. It is produced for reaction with polyols to form polyurethanes and its vapors should be avoided.isocyanate) two part foam-in-place resin system.  Once cured it remains rigid and has high strength at temperatures up to 135°C, with short time exposure at 163°C.

It is primarily used for encapsulation of electronic modules or components, antennas, radome cores and a variety of other structural applications.  ECCOSTOCK^® FPH can also be used as a thermal barrier in electrical/electronic applications as well as for vibration dampening requirements.

All products in the ECCOSTOCK^® FPH series are supplied as two component kits consisting of a Component X (resin) and Component Y (catalyst). 

Shipping Note: ECCOSTOCK^® FPH is a hazardous material which implies some safety precautions when being shipped.